The use of MLC and SLC NAND memory modules ensures high performance in harsh environments such as low temperature, dust and vibration. The Renice X5 is fully JEDEC MO-300 industry standard and can be used in a wide variety of industrial applications.

Specifications:

• Maximum interface speed: 300 MB/s
• Maximum read speed: 240 MB/s
• Maximum write speed: 160 MB/s
• Access Time: 0.1 ms
• Dimensions: 50.95 mm x 30 mm x 3.65 mm
• Weight: < 10 g
• Interface: mSATA MO 300B (defined in JEDEC specification) SATAII 3Gb/s
• Capacity: 8GB ~ 256GB (MLC) / 4GB ~ 128GB (SLC)
• Power supply voltage: 3.3V (±5%)
• Power consumption: 1.02-1.1W @ active; 0.5W @ idle
• Temperature range: 0 ... +70 ℃ (commercial) or -40 ... +85 ℃ (industrial)
• Static and dynamic wear distribution system, spoiled block management algorithm
• Dynamic power management, SMART (Self-Monitoring, Analysis and Reporting Technology)
• BCH ECC hardware support: 72-bit per 1KB
• TRIM support (requires OS support)
• Data retention time: 10 years (@25)